Design And Reuse SoC News Alert

July 6, 2004

Welcome to issue of July 6, 2004 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

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Camera Interface from sci-worx GmbH

Mixed Radix DFTs from RF Engines Ltd

Configurable Level 2 Cache Controller intended for integration into AMBA AXI-based ASIC, ASSP and SoC systems from ARM Ltd.

USB2.0 OTG LS-FS 3.3/1.8 from ChipIdea Microelectronics SA

Very low power shunt voltage reference on IBM 0.13um from LTRIM Technologies

SD Memory Controller from Arasan Chip Systems

12 Bit 60 MSPS Pipeline ADC For CMOS Imaging from Silicon & Software Systems

Unified HW/SW co-verification tool from Adveda

Multi-processor Integrated Development Environment from AdvEDA

Unified HW/SW co-verification tool, incl SW debugging from AdvEDA

Power Reduction Techniques for Ultra-Low-Power Solutions

FPGAs accelerate time to market for industrial designs

Scatternet - Part 1: Baseband vs. Host Stack Implementation

An introduction to open-source hardware development

ESL 'ecosystem' enables power-efficient Application specific instruction processors (ASIPs)

Sigma-delta techniques extend DAC resolution

IP/SOC PRODUCTS

ARM And Aplix To Deliver Best-In-Class Java Solutions For Wireless Devices

IndigoVision announce AMBA interface for Mainstream MPEG-4 Video Codec

NewLogic Offers World's First Silicon Proven Digital Interface for WiFi Applications

Sarnoff Now Licensing QCIF, CIF Codecs For MPEG-4 Video On Cell Phones, Other Portable Devices

Altera's Cyclone II/Nios II Combination Delivers Industry's Lowest-Cost Soft Processor Solution

LSI Logic Announces QDR-2 SRAM Memory Interfaces for Developing High-End Network and Storage Gear

Faraday Introduces High-Resolution MPEG-4 Solution for Multimedia Application

STRUCTURED ASIC

Leopard Logic's Gladiator CLD Silicon Successfully Qualified

FOUNDRIES

NEC merges process, SoC units

BUSINESS

Amphion Semiconductor, a DSP core firm sold to Conexant, says report

Transdimension announces acquisition of peripheral connectivity property and product portfolio from ARC International

Transdimension closes $18 MILLION in new funding

MIPS Technologies Stock Added to the Russell 3000 U.S. Stock Market Index

ARC International sale of USB Business to Transdimension

Texas Instruments Collaborates With ARM As Part Of Its Industry-Leading Silicon-Based Security Solution

Sequans, WIMAX chipset pioneer, raises its first financing round from CapDecisif and I-Source Gestion

DEALS

Rheinmetall Defence contract RF Engines for complex Signal Processing Design

Innostream selects TTPCom's EDGE technology

Vicor Announces V-I Chip License to Sony

Jungo Provides Infineon with its OpenRG Software: Software Enables Complete VoIP Solutions for IP Phones, ATAs and Voice Gateways

Sony Ericsson Licences ARM JTEK Software For Jazelle Java Acceleration Technology

Xyratex Adopts Mentor Graphics PCI Express Intellectual Property for Advanced Switching Industry Standard

SuperH provides STARC with RISC CPU Core to verify advanced 90nm design methodology

PEOPLE

SafeNet Announces Promotion of Carole Argo to President and COO; Names Former Microsoft Executive Ken Mueller as SVP and CFO

DESIGN SERVICES

QualCore Logic Validated as "Ready for IBM Technology"

EMBEDDED SYSTEMS

Elliptic Evaluation System Reduces Risk and Time to Market for IC Projects

ZiLOG's Z8Encore! and eZ80Acclaim! Flash Microcontrollers Supported by Data I/O Turnkey Programming Solution

FPGA/CPLD

Xilinx Launches Roadmap For Up To Two-Thirds Power Reduction In Spartan-3 FPGAs

Altera Begins Shipping Industry's First High-Density 90-nm FPGAs to Customers

Partnership With TSMC Yields First Silicon Success on Altera's 90-nm, Low-k Products

Xilinx Delivers Lowest Cost, Easy-to-use $99 Spartan-3 FPGA Starter Kit

EDA

Carbon, CoWare link RTL to SystemC

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